Abstract
Silicon nitride (Si3N4) is a high demanded structural ceramic with exceptional mechanical, thermal and chemical properties. Poor surface integrity and limited material removal rate due to high tool wear and cutting forces are the main problems of grinding this material. A novel laser-assisted grinding process is developed to overcome the current technological constraints in the grinding of Si3N4. Ultra-short pulsed laser radiations are efficiently applied to create ablation, controlled thermal damages and enhance the material removal rate in the grinding process. Two different laser structures have been produced on gas-pressure-sintered Si3N4 with various laser scan speeds and laser line spans. The high performance of the developed process is shown by experimental results. A substantial reduction in tangential and normal grinding forces and a slightly improved surface roughness have been achieved. The analysis of the surface integrity has shown a damage-free ground surface via laser assistance, where the pattern type of structures had a significant influence on the process results.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: The International Journal of Advanced Manufacturing Technology
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
