Abstract
This paper reports the results of laser applications by using Quantronix’ Nd:YAG UV laser (355nm) with high output power and high repetition rate. Typical applications include polyamide film cutting, polyamide resin slab scribing, glass layer ablation from silicon wafer, amorphous silicon foil cutting, sapphire wafer deep scribing and drilling, fused silica coated silicon wafer cutting, glass substrate marking, etc.This paper reports the results of laser applications by using Quantronix’ Nd:YAG UV laser (355nm) with high output power and high repetition rate. Typical applications include polyamide film cutting, polyamide resin slab scribing, glass layer ablation from silicon wafer, amorphous silicon foil cutting, sapphire wafer deep scribing and drilling, fused silica coated silicon wafer cutting, glass substrate marking, etc.
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