Laser ablation deposition as a preparation method for electronic materials

Abstract

In the development of new electronic materials and devices, laser ablation deposition offers a quick and relatively easy technique to realise complicated material compositions and multilayer structures. This paper presents laser ablation deposition of different types of thin film materials, each having potential use in electronic applications. The materials are: YBa2Cu3O7-δ superconducting films and YBa2Cu3O7-δ/PrBa2O7-δ superlattices; piezoelectric lead zirconium titanate (PZT) and PZT/YBa2Cu3O7-δ heterostructures; Cu(In,Ga)Se2 semiconductor photovoltaic materials and amorphous diamond-like carbon films. The deposition of these materials was carried out mostly using a pulsed XeCl excimer laser, either in an in situ process on a heated substrate or by post deposition annealing.