Abstract
The large real-time hologram device made by the previous Bi12SiO20 single crystal wafer cutting method poses several problems such as a large residue of material hinders the practical use. A study was carried out to fabricate a real-time hologram device using inexpensive laterally cut circular (1 0 0) Bi12SiO20 single crystal wafers which would be suitable for practical use for 3-dimensional display. An angle incident on a (1 0 0) wafer is applicable to the real-time hologram. An optimal electrode design for a device with uniform diffraction efficiency was considered, and the device properties were experimentally investigated.
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