Large‐Scale Fabrication of Surface Ion Traps on a 300 mm Glass Wafer

Abstract

Herein, a large‐scale fabrication of radio frequency (RF) surface ion traps on a 300 mm glass wafer using a standard foundry process is reported. Established wafer‐level packaging process of electroplated Cu with Au finish is used to fabricate the surface electrodes directly on the glass wafer substrate. A trap is tested by loading it with laser‐cooled 88Sr+ ions. The trap shows a stable operation with RF amplitudes in the range of 100–250 V at 33 MHz frequency. The ion lifetime is on the order of 30 min with laser cooling with a vacuum chamber pressure of ≈5 × 10−11 mbar. These results demonstrate the potential of large‐size foundry glass substrates to realize scalable and integratable trapped ion‐based quantum devices.