Abstract
This paper presents a state-of-the-art large scale array antenna packaging technology for 5G mmwave base stations. Conventionally, mmwave antennas have been implemented in a module type integrated with RFIC using low loss and high-cost PCB including all stacked layers. The structure is suitable for antenna of small size products such as mobile devices and small cells. However, the packaging scheme is not able to be applied to large scale array antenna for a base station due to lower yield and higher cost. In this work, core techniques are proposed for A6G (above 6GHz) base station antennas. A FPCB antenna laminated on a hybrid PCB enables higher yield and cost reduction with minimum PCB lamination process. The conduction loss between RFIC and antenna is minimized with the coaxial type of vias. A prototype exploiting the techniques is successfully demonstrated.
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