Abstract

A focused ion beam (FIB) sample preparation technique is developed to produce very large areas of electron transparent material for plan-view transmission electron microscopy measurements from specific layers in a multi-layer device structure. An initial cross section FIB cut allows plan-view sample creation from any layer of interest, and therefore rapid characterization of the defect density as a function of depth is achievable for structures containing multiple layers, such as multi-junction metamorphic layer structures for high efficiency III-V solar cells. Uniform electron transparent plan-view areas of greater than 100 μm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> are extracted from a cross-section to facilitate observation of defect densities as low as ~10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">6</sup> cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-2</sup> . To demonstrate the technique, the active cell layers of two inverted metamorphic III-V solar cell structures have been imaged to reveal defect densities as high as 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">9</sup> cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-2</sup> and as low as 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">6</sup> cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-2</sup> .

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