Lap welding with direct diode laser of thin foil on thick substrate

Abstract

Lap welding of thin foils on thick substrate is required for manufacturing of electronic devises such as a pressure sensor. The decrease of thickness of foils makes lap welding of them on thick substrates more difficult because of the generation of the thermal distortion around the heating area and so on. Heat conduction welding with an elliptical beam of a direct diode laser is effective in butt-welding of thin foils because of slight thermal distortion caused by the low power density. Lap welding of thin foils on thick substrates was examined with a direct diode laser system. Lap welding of thin stainless foils of 20µm in thickness on thick substrate of 2mm in thickness was made possible at a high welding speed of 0.5m/sec without wrinkles, by a sufficient contact of the thin foils with the substrates and pre-heating. It was recognized that heat conduction welding with a direct diode laser was applicable to lap welding of thin foils on thick substrates.Lap welding of thin foils on thick substrate is required for manufacturing of electronic devises such as a pressure sensor. The decrease of thickness of foils makes lap welding of them on thick substrates more difficult because of the generation of the thermal distortion around the heating area and so on. Heat conduction welding with an elliptical beam of a direct diode laser is effective in butt-welding of thin foils because of slight thermal distortion caused by the low power density. Lap welding of thin foils on thick substrates was examined with a direct diode laser system. Lap welding of thin stainless foils of 20µm in thickness on thick substrate of 2mm in thickness was made possible at a high welding speed of 0.5m/sec without wrinkles, by a sufficient contact of the thin foils with the substrates and pre-heating. It was recognized that heat conduction welding with a direct diode laser was applicable to lap welding of thin foils on thick substrates.