Abstract

We have studied a combiner that can withstand high power while minimizing insertion loss in high frequency band. In particularly, because the output power that can be output per unit elements is much lower in the Ku band and above than in the low frequency band , it is necessary to combine many semiconductor elements in order to make a high power SSPA. A planar combiner such as a microstrip, as the number of elements to be combined increases, the insertion loss increases proportionally, resulting in a reduction in the overall system efficiency and an increase heating value also. The planar combiner also have some problems due to the low power handling rate. To improve these problems, we proposed a Cavity Radial Combiner. A Ku band 16-way Cavity Radial Combiner was fabricated and measured. As a result, it was tested 14dB return loss and over 94.5 % output combining efficiency in design band.

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