Abstract
Cu 6 Sn 5 is an important intermetallic compound used in lead-free soldering and anode materials for Li-ion batteries. Cu 6 Sn 5 exists in at least two crystal structures, with a transformation from hexagonal η-Cu 6 Sn 5 at temperatures higher than ∼186 °C to monoclinic η′-Cu 6 Sn 5 at lower temperatures. Using variable temperature synchrotron X-ray diffraction analysis, the kinetics of the η–η′ transformation are investigated and a time–temperature transformation diagram is partially developed. The significance of the results in terms of phase and dimensional stability in solder joints are discussed.
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