Abstract
The kinetics of intermetallic compounds (IMCs) formation at the 91Sn–8.55Zn–0.45Al lead-free solder alloy/Cu substrate interface during soldering and subsequent aging have been studied using X-ray diffraction (XRD), scanning electron microscopy (SEM), energy dispersive spectrometer (EDS), transmission electron microscopy (TEM) and electron diffraction (ED). From the XRD results, γ-Cu 5Zn 8 and Cu 6Sn 5 are found in the eutectic 91Sn–8.55Zn–0.45Al solder alloy/copper interface, but no γ′-Cu 9Al 4 is formed in the wetted samples aged at 423 K for 250 h. However, by TEM observation and ED analysis, γ′-Cu 9Al 4 is found at the interface of the solder alloy and the Cu substrate, and the IMC growth can be expressed as X = (Dt) 1/2. The activation energy of the γ-Cu 5Zn 8 layer growth in 91Sn–8.55Zn–0.45Al solder alloy/Cu interface is determined as 53.77 kJ/mol.
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