Abstract
Intermetallic coumpound formation at metal–metal interfaces was observed for thin film couples of Al and transition metals such as Cr, Ti, Hf, Zr, Co, Ta, Pd, and Pt. The Al–Cr system was investigated in some detail using a conductance method and nuclear backscattering for reaction‐rate measurements. The compounds CrAl7 and Cr2Al11 were identified and their growth was found to be diffusion controlled. The temperature dependence of the rate constant for CrAl7 obeyed an Arrhenius plot from 300° to 450 °C with an activation energy of 1.91±0.1 eV. The Al‐rich phases of the remaining transition metals were investigated; the compounds either exhibited a planar interface with parabolic growth kinetics or an irregular interface with nonparabolic growth. An empirical relationship involving the melting point and stability of the compounds was proposed to explain the different growth kinetics.
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