Abstract
Abstract A quantitative description for the dynamic mechanical properties of a reacting system as a function of both the viscoelastic and kinetic intrinsic behavior of the polymeric system was developed in this work. The model was tested experimentally by subjecting plaques of tetraglycidyl-4,4′-diaminodiphenylmethane partially cured with diaminodiphenyl sulfone to dynamic mechanical measurements at four isothermal temperatures. The kinetic viscoelasticity model was used to analyze the resulting data and to obtain both the characteristic intrinsic kinetic and viscoelastic parameters. The effects of temperature on the model parameters were investigated. Activation energies provided by the model for the curing reaction were found to agree with those obtained experimentally by other techniques. Experimental frequency was found to be an important factor in the kinetic analysis of dynamic mechanical data of curing systems. Finally, the analogy between dielectric relaxation and dynamic mechanical relaxation was...
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