Abstract
The rates of copper corrosion were determined by measuring the limiting current of anodic dissolution of copper in phosphoric acid in presence and in absence of cetyl trimethyl ammonium bromide (CTAB) and cetyl pyridinium bromide (CPYB). The rate of corrosion is found to decrease by increasing the concentration of the surfactant. The percentage of inhibition ranged from 1.85 to 33.97% depending on the type of surfactant and its concentration. Increasing the copper electrode height, and concentration of H3PO4 decreases the rate of copper corrosion. The investigated adsorption isotherms indicate that the two surfactants fit Langmuir and Flory Huggins isotherm. The thermodynamic parameters show that corrosion is a diffusion controlled process. The dimensional analysis method was used to obtain the overall mass transfer correlations under the study conditions.
Highlights
Copper is one of the preferred metals in industry owing to its excellent electrical and thermal conductivities, good mechanical workability and its relatively noble properties [1,2,3]
It has been accepted that the corrosion inhibition process results from the formation of organic inhibitor films on the metal surface [10]
The present study of cupper corrosion in presence of phosphoric acid and surfactants led to the following important conclusions: 1. The rate of copper corrosion decreases by increase of phosphoric acid concentration
Summary
Copper is one of the preferred metals in industry owing to its excellent electrical and thermal conductivities, good mechanical workability and its relatively noble properties [1,2,3]. Corrosion inhibition of copper in a wide variety of media has attracted the attention of a number of investigators [4,5,6,7,8]. It has been accepted that the corrosion inhibition process results from the formation of organic inhibitor films on the metal surface [10]. The anodic dissolution of copper in organic solvent environments is influenced by its concentration [11]. A study of the inhibiting effect of some inhibitors in case of copper corrosion in different concentrations of phosphoric acid solution was carried out. The aim is to discuss the mechanism of protection given by these organic additives as CPYB and CTAB on the electrodissolution of copper in H3PO4 and the factors that affect corrosion process
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