Abstract
Sputtering by collimated low energy ion beams can lead to a wide range of spontaneous pattern formation on different surfaces under different conditions. We describe a kinetic phase diagram as a way to organize pattern formation behavior observed on Cu(001) surfaces as a function of flux and temperature. The characteristics of pattern formation in several kinetic regimes are described, and the transitions between the different regimes are discussed in terms of the competition between mechanisms for surface roughening and smoothing.
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