Abstract
AbstractIn this article, we study the process of polymerization of a modified ED‐20 epoxy binder under conditions of highly filled systems. It is found that modifying additives affect the process of polymerization of the binder, increasing the degree of conversion of epoxy groups of ED‐20 resin, speeding up the process of polymerization, and increasing the exothermic effect of the reaction. Curing in the presence of a modifying silicon‐containing additive takes place in a mode that promotes the formation of a more ordered structure, creating opportunities for relaxation of internal stresses and favorable conditions for the formation of an ordered microstructure. The equations sufficiently fitting the measured points of the concentration of epoxy groups are calculated. We obtain the kinetic curves of curing, which illustrate the process of heat release of the ED‐20 binder and the same system modified with mineral fillers. It is found that the heat release occurs more intensively when modifiers are introduced into the epoxy binder. It is derived that the experimental data of kinetics of heat release at considered time range can be sufficiently described by a parabolic equation.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
