Abstract
The kinetics of grain boundary segregation in Cu(Bi) alloys has been studied at temperatures of 600 and 850°C by Auger electron spectroscopy. A substantial acceleration of the grain boundary segregation kinetics in the two-phase area of the Cu–Bi phase diagram is observed. To explain this acceleration, a model of dislocation diffusion is proposed. In the framework of the model, the accelerated kinetics of grain boundary segregation in the two-phase area of the Cu–Bi phase diagram results from the microscopic pipe-like precipitation of a Bi-rich liquid phase along the dislocation cores. The dislocation diffusivities are estimated and two kinds of diagrams of the segregation kinetics are constructed.
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