Abstract
Multifunctional epoxy resin series Epiclon HP-7200 is classified under the high performance series and is well known for its application in electrical encapsulation as it exhibits excellent mechanical and electrical properties. In addition, they have an advantage of an ultra low moisture absorption compared to other conventional cresol novolac (ECN) and biphenyl epoxy resins, which potentially makes it the next new mainstream of epoxy resins in electronics application. In this paper, kinetic study of various concentration of Epiclon HP-7200 (40-70 wt %) with divinyl ether (DVE) as the reactive solvent has been performed by Photo-Differential Scanning Calorimetry (DPC). The thermal stability of the Epiclon HP-7200 solutions has been analyzed by DSC and TGA.
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