Abstract
Molded Interconnect Devices (MID) is an innovative technology in the field of mechatronics which abandons the conventional circuit boards and integrates the mechanical and electronic functions directly on the 3D injection molded thermoplastics. The Laser Direct Structuring (LDS) is the most efficient and advanced technology for the manufacrure of MID. In this paper, LDS technology and equipment have been introduced. Then through kinematic modeling analysis of the LDS equipment, getting the forward and inverse solution of laser focus position in the 3D space. And the LDS equipment processing path has been planned based on the kinematic analysis. Finally the simulation system of LDS has been developed based on Open CASCADE in order to inprove the processing efficiency and quality of MID.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
