Abstract

As traditional Silicon transistor scaling fast approaches its limits alternate channel materials are being actively researched to enable a new era of power constrained Very Large Scale Integrated (VLSI) circuit design. The outstanding transport properties of compound semiconductor III-V materials make them very attractive candidates to continue scaling into deep sub-micron technology nodes beyond 14nm. However several key challenges need to be addressed in order for these new materials to replace state of the art Strained Silicon, High-k metal gate or Silicon on Insulator (SOI) technologies. This paper discusses the key issues involved and recent research highlights in III-V MOSFETs motivating their viability for future low power CMOS technology.

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