Key Technology of Disassembling Waste Printed Circuit Board Assembly for Components Reuse

Abstract

Waste printed circuit board assembly(PCBA),which has lots of high-value components and toxic substances,is a key unit in the disposal of waste electric and electronic equipment(WEEE).Up to now material recycling is still the main disposal method of waste PCBA.Studies show that the components still keep good condition when PCBA retired.In order to guarantee the reusability of the disassembled components,the components reuse-oriented disassembly technology is studied,in which the key technologies of heating and disassembly are discussed in detail.The key heating technology is researched for the different joint type of PCBA,the temperature distribution of surface mount devices(SMD) major PCBA is studied quantitatively.For getting the suitable disassembly mode of PCBA,the disassembly acceleration and separating displacement of components on PCB are defined and the disassembly energy models for different kinds of components are set up.On the basis of the heating and disassembly technology,two kinds of disassembly apparatus are developed for through-hole devices(THD) major PCBA and SMD major PCBA respectively.Also,the performance testing technology of certain kinds of disassembled components,such as SMD,THD,resistor and capacitance,is proposed.In the end the disassembly parameters are optimized to achieve high the separation ratio and reuse ration of components with orthogonal experiment.