Abstract
Mechanical behavior of a thin film deposited on a substrate would be affected by basically four parameters, that are strength of the film, strength of the interface, Young's modulus of the film and residual stress in the film, provided that properties of the substrate are given. Therefore independent measurement of these four parameters should be the key to evaluate the mechanical properties of thin films on substrates as the materials systems made of films and substrates and interfaces. A new systematic method of measurement for these parameters is presented, where just a simple configuration of specimen with "film projection" in various length is used. An application example is demonstrated for the case of a diamond film on a WC-Co substrate.
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