Joining of sintered SiC ceramics at a lower temperature using borosilicate glass with laser cladding Si modification layer

Abstract

The silicon carbide whose surface had been modified by laser cladding silicon layer was soldered by borosilicate glass. And the borosilicate glass solder had a thermal expansion coefficient similar to that of the silicon carbide substrate. The laser cladding silicon layer significantly improved the wettability between molten glass solder and silicon carbide and could reduce the soldering temperature. A sandwich-like joining structure (SiC/Si/solder/Si/SiC) was made after the borosilicate glass slurry put on the laser cladding silicon layers. The microstructure, compositions, and interfacial properties were studied. Results showed that good adhesion between silicon carbide and the glass soldering layer was achieved. The flexural strength of the connection structure prepared at 900 °C in the air reached 110 MPa. This research provides an effective technical solution for realizing local heat treatment soldering of large silicon carbide components.