Abstract
The vacuum brazing of dissimilar electronic packaging materials has been investigated. In this research, this applies silicon particle-reinforced aluminum matrix composites (Sip/Al MMCs) to Kovar alloys. Active melt-spun ribbons were employed as brazing filler metals under different joining temperatures and times. The results showed that the maximum joint shear strength of 96.62 MPa was achieved when the joint was made using Al-7.5Si-23.0Cu-2.0Ni-1.0Ti as the brazing filler metal at 580 °C for 30 min. X-ray diffraction (XRD) analysis of the joint indicated that the main phases were composed of Al, Si and intermetallics, including CuAl, TiFeSi, TiNiSi and Al3Ti. When the brazing temperature ranged from 570 °C to 590 °C, the leakage rate of joints remained at 10−8 Pa·m3/s or better. When the joint was made using Al-7.5Si-23.0Cu-2.0Ni-2.5Ti as the brazing filler metal at 580 °C for 30 min, the higher level of Ti content in the brazing filler metal resulted in the formation of a flake-like Ti(AlSi)3 intermetallic phase with an average size of 7 µm at the interface between the brazing seam and Sip/Al MMCs. The joint fracture was generally in the form of quasi-cleavage fracture, which primarily occurred at the interface between the filler metal and the Sip/Al MMCs. The micro-crack propagated not only Ti(AlSi)3, but also the Si particles in the substrate.
Highlights
With the rapid development of the aerospace industry, the electronic products in aerobat are tending towards miniaturization and high-power density, aiming to reduce the component weight
This study provides a new approach for joining the dissimilar electronic packaging materials of Sip /Al MMCs and Kovar used in the aerospace industry
The amount of primary Si and the eutectic structure were reduced, which which mainly resulted from the Si consumption in the alloy due to the formation of intermetallic mainly resulted from the Si consumption in the alloy due to the formation of intermetallic compounds containing Si elements
Summary
With the rapid development of the aerospace industry, the electronic products in aerobat are tending towards miniaturization and high-power density, aiming to reduce the component weight. This leads to increased requirements for electronic packaging materials, such as light weight, low coefficient of thermal expansion and high thermal conductivity [1,2,3,4]. Among the numerous advanced electronic packaging materials, silicon particle-reinforced aluminum matrix composites (Sip /Al MMCs) possess comprehensive performances that make them more promising and attractive for their application in the aerospace field instead of the conventional The appropriate mechanical properties and gas tightness of the electronic packaging components manufactured by the joining process are requested [7,8,9,10].
Sign-in/Register to view highlights & summary Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
