Joining of NiAl to Nickel-Base Alloys by Transient Liquid Phase Bonding

Abstract

ABSTRACTA transmission and scanning electron microscope investigation is undertaken to study microstructural development during transient liquid phase (TLP) bonding of NiA1 to Ni-base substrates. The bonds were produced through a conventional technique employing a Cu foil interlayer or a widegap technique using a composite preform containing powders of NiAl and Cu. The time required for completion of isothermal solidification was greatly reduced in wide-gap bonds as compared to conventional bonds. Microstructural features of conventional TLP bonds of polycrystalline-NiAl/Ni were controlled by the ratio of Al: Cu across the joint. The precipitation of the a phase encountered in polycrystalline- NiAl/Martin Marietta 247 superalloy (MM247) bonds was suppressed in wide-gap bonds of single crystal-NiAl(Hf) and MM247. In general, the extent of second phase precipitation, in the asbonded condition, was greatly reduced by the use of the wide-gap technique. However, extensive precipitation of HfC and W-rich phases was observed after post-bond heat treatments.