Abstract
Microjoining technologies are crucial for producing reliable electrical connections in modern microelectronic and optoelectronic devices, as well as for the assembly of electronic circuits, sensors, and batteries. However, the production of miniature sensors presents particular difficulties, due to their non-standard designs, unique functionality and applications in various environments. One of the main challenges relates to the fact that common methods such as reflow soldering or wave soldering cannot be applied to making joints to the materials used for the sensing layers (oxides, polymers, graphene, metallic layers) or to the thin metallic layers that act as contact pads. This problem applies especially to sensors designed to work at cryogenic temperatures. In this paper, we demonstrate a new method for the dynamic soldering of outer leads in the form of metallic strips made from thin metallic layers on ceramic substrates. These leads can be used as contact pads in sensors working in a wide temperature range. The joints produced using our method show excellent electrical, thermal, and mechanical properties in the temperature range of 15–300 K.
Highlights
IntroductionThe quality of electronic connections has a decisive impact on the reliability of electronic and mechatronic devices
The composition of the two-metal alloy created during soldering depends on the components of the alloy, the temperature, and the kinetics of the solidification process
A) joints were on integrated geneous ceramic substrate with high thermal conductivity
Summary
The quality of electronic connections has a decisive impact on the reliability of electronic and mechatronic devices. The continuing development and miniaturization of electronic devices has created new challenges related to electrical connections. The factors causing these difficulties can be divided into three groups: technological factors, environmental factors, and functional factors. Technological factors include packaging density (the miniature dimensions of the elements to be joined, small contact pads, very thin wires), dimensional disproportions (e.g., connecting a thin wire to a massive element) and the physical properties of the materials (no metallurgical affinity, lack of solderability or weldability). Functional factors relate to the increased requirements for reliability (for military technology, aviation, spacecraft, automobiles, and safety systems)
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