Abstract
The potential of microwave heating for joining of dissimilar metals is not much explored. This work is a unique investigation on finite element method (FEM) simulation of joining oxygen free copper (OFC) to stainless steel (SS304) using microwave energy. Cu powder of size 4 μm was used as an interlayer for the simulation which is followed by experimental study. COMSOL Multiphysics 5.3a was used to simulate the joining of dissimilar metals by microwave heating and to achieve the temperature reading across the joint cross-section. The temperature of ∼966 °C was observed at the joint interlayer/interface and ∼1062 °C at the graphite susceptor for the microwave exposure time of 14 min. The temperature of the susceptor were measured experimentally in a time interval of 60 s and was observed to be in agreement with the simulated results. The microstructure of the joint samples processed between 12 and 14 min of microwave exposure time was analysed. The microstructure analysis of joint depicted that, the porosity at the interlayer decreases with increase in microwave exposure time.
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