Abstract
In this paper, the influence of vacuum annealing on the mechanical properties of gold (Au) bonding wires is described. Au bonding wires with the diameter of 25μm are subjected to quasi-static uniaxial tensile tests at laboratory air. The bonding wire specimens are prepared by the attachment of a wire to a silicon (Si) frame fabricated by deep reactive ion etching (DRIE). The Young's modulus and 0.2% offset yield strangth are 113GPa and 310MPa on average. By annealing at 100〜300℃ for 10min in vacuum, the Young's modulus value gradually decreases with increasing annealing temperature, whereas the yield strangth value drastically drops in the annealed wires at over 200℃. The annealing effect is discussed in the light of a change in the number of recrystallized grains in the wires.
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