Abstract
A synchrotron radiation X-ray micro-tomography system called SP-μCT with a spatial resolution of about 1μm has been developed in SPring-8. In this work, SP-μCT was applied to the nondestructive observation of fatigue crack propagation appearing due to thermal cyclic loading in lead-free solder joints of chip type resistor. In order to show the whole image of crack propagation process, 3D rendered images of fatigue cracks was extracted from CT images. The results show that nondestructive inspection of lead-free solder joints of chip type resistor by the micro CT system is useful in combination with three-dimensional visualization of the thermal fatigue cracks.
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