J0601-1-4 固体表面間の接触熱抵抗に関する理論的研究 : 熱流の縮流に及ぼすうねりの影響([J0601-1]電子情報機器,電子デバイスの強度・信頼性評価と熱制御(1))

Abstract

To minimize the volume and weight of electronic systems like spacecraft, aircraft and computers, the systems are packed with high-density electronic devices. In addition to this situation, the heat dissipation density of microprocessors has been increased at a rapid pace. Under such a high heat dissipation density, thermal contact conductance plays an important role in cooling of electronic equipment. In this paper, the effect of surface waviness on the heat flow field near the contact interface has been studied analytically. In the analysis, a contact surface model with waviness and roughness is introduced, and two-dimensional cylindrical heat conduction equation has solved numerically. From a series of numerical calculations, the effect of surface waviness on the heat flow field has been clarified.