Abstract
Three-dimensional integrated circuits (3D ICs) are receiving increasing attention as a novel approach to improve the performance of semiconductor devices. This new technology necessitates advanced thermal management to effectively dissipate heat generated inside each layer of stacked chip. In order to explore the feasibility of micro heat pipes driven by electroosmotic (EO) pumps in 3D ICs, we prepared the closed-loop microchannels with EO pumps and resistive heaters, which simulate hot spots, and evaluated the pumping and cooling performances. A number of EO pump elements are connected in series so that the high flow rate and high discharge pressure are realized with relatively low applied voltage. The performance evaluation of EO pumps showed that the maximum flow rate and pressure are 38 (μL/min and 10.3 kPa, respectively, at the applied voltage of 40 V. In addition, the circulation of working fluid (2-propanol) by the EO pump significantly decreases the temperature around the heater.
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