Abstract
In this paper, the fatigue reliability of Sn-3.0Ag-0.5Cu lead-free solder joints was estimated. First, we constructed a plastic-creep constitutive model based on results of tensile tests and creep tests. Then, we conducted FEM analysis of the lead-free solder joint under thermal cycle load. The thermal fatigue life was estimated by comparing inelastic strain energy and low-cycle fatigue test results. As a result, it was confirmed that analysis result was in good agreement with the experimental result.
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