J031042 基板スルーホールの熱応力解析におけるガラスクロス構造の影響([J03104]電子情報機器,電子デバイスの強度・信頼性評価と熱制御(4))

Abstract

The glass epoxy substrates are commonly used for printed circuit boards (PCBs). They are composed of glass fiber cloths and epoxy resins. But in many cases they are modeled as homogeneous isotropic elastic bodies because of the computational restriction.In this study, we modeled the glass cloth structures of glass epoxy substrates and carried out the thermal stress analysis of the substrate with through-hole by using large-scale FEM analysis.The result of glass cloth model analysis agreed better with the experimental result than the result of homogeneous isotropic elastic body model.