J012023 熱履歴による樹脂の粘弾性物性変化を考慮した積層パッケージの反り予測解析([J012-02]電子情報機器、電子デバイスの強度・信頼性評価と熱制御(2))

Abstract

Mechanical reliability of electronic packages is one of the most important problems for the reliability of electronic products. Reduction of the warpage of an electronic package is useful to increase its mechanical reliability. The warpage of an electronic package often shows a hysteresis curve during a thermal cycle. However, it was difficult to simulate the hysteresis. In this study, we performed the viscoelastic analysis of a bonded sample of Si chip and underfill resin. This sample shows the hysteresis of the warpage during a heating and cooling heat cycle. We measured the master curves of the relaxation modulus using Dynamic Mechanical Analyzer (DMA) before and after heating. Then, we analyzed the warpage of the specimen with considering the change of the master curve of relaxation modulus of the underfill resin. The hysteresis of the warpage of the bonded specimen was well expected using the proposed method.