Abstract
The natural cooling capability and flow field in relatively small electronic equipment were studied by numerical simulation. A vertical multi-channel model was used as an numerical model of electronic equipment. The multi-channel is an idea of natural cooling enhancement. The multi-channel model is constructed with two copper walls simulated the printed circuit boards, two acrylic walls simulated casing walls and four partitions. The multi-channel model has five ducts with 2mm thick copper partitions between two copper walls. The clearance between the copper walls is varied from 5 mm to 15 mm. The velocity profiles and temperature rise of air in the channel and temperature of the copper walls were obtained and the availability of multi-channel structure is discussed.
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