Abstract
The conductivity of ITO–Ag–ITO films declines with the deposition temperature increased above 200 °C, because the surfaces of Ag layers become rough that scatter the conduction carriers. The solid-solution Ag–Ti alloy and Ag–Ti–Cu alloy are developed to improve the stability of the surface morphology of Ag layers. This research proves that the Ag–Ti film can keep a smooth surface at an even higher deposition temperature. This leads ITO–AgTi–ITO films to have low resistivity at high deposition temperatures. However, further addition of Cu atoms into Ag–Ti films causes several spikes formed on the surfaces probably relative to the relaxation of strain energy. The conductivity of the ITO–AgTiCu–ITO film will decline when a large amount of spikes is formed on the surface of Ag–Ti–Cu layer at a high deposition temperature.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
