Isotherms of surface tension in copper-based systems

Abstract

The surface tension is the most important characteristic of interfaces in materials. The knowledge of this characteristic allows one to calculate the properties of materials caused by the presence of surfaces, such as the work of brittle fracture and adsorption properties. This characteristic likewise plays an important role in the theory of capillary phenomena. For this reason, the knowledge of the magnitude of surface tension for different surfaces is of great interest for practical application. Of even greater interest is systematic data for different compositions of solid solution of one and the same system (isotherms of surface tension) or for different temperatures with one and the same composition (concentration isolines of surface tension). These data make it possible to predict the properties of materials in a wide range of compositions or temperatures, which is significant because of limitedness of techniques of measurement of surface properties and capabilities of measurement instruments. In this work, the surface-tension isotherms for copper-based systems were obtained. The methods of zero creep and thermal grooving used in this work were described in sufficient detail in [1‐7]. The essence of the zero-creep method consists in the determination of the load P 0 or stress σ 0 , i.e., load per cross-sectional unit area, at which the deformation of the sample is absent. In this case, it is supposed that the load places in complete equilibrium the forces of surface tension operating in the sample.