Isothermal Peritectic Coupled Growth in Directionally Solidified Cu-20 wt pct Sn Alloy

Abstract

Isothermal peritectic coupled growth (PCG) has been experimentally observed in directionally solidified Cu-20 wt pct Sn alloy at pulling rate of 1 μm/s under a temperature gradient up to 45 K/mm. The PCG growth interface temperature is determined above the equilibrium peritectic temperature T P. Diffusion coupling at and parallel to the solid/liquid interface necessary for PCG growth above T P is first experimentally proven.