Abstract
Density functional theory studies were performed to study the structure and bonding of (hexafluoroacetylacetonate)-copper(I)-(trimethylvinylsilane) [Cu(hfac)(tmvs)], an ideal and important Cu(I)-CVD compound. A popular three-parameter hybrid density functional (B3LYP) with 6-311+G(d,p) and an effective core potential included LanL2DZ basis set was utilized for this purpose. The (hfac)Cu–(tmvs) bond energy of approximately 30 kcal mol−1 obtained at the B3LYP/6-311+G(d,p) level of theory reveals that the Cu–olefin bond in Cu(hfac)(tmvs) is not as weak as previously estimated/assumed and, hence, that the substrate plays a vital role in copper film formation from Cu(hfac)(tmvs). Bonding analysis reveals that fairly strong (hfac)Cu–(tmvs) bonding is the result of DCD-model σ-donation and π-back-bonding between the copper and tmvs in Cu(hfac)(tmvs).
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