Abstract
With the development of integrated circuits, SiP (system in package) technology has been widely used in recent years. SiP often integrates multiple chips. Although this kind of packaging method is highly integrated, it also brings heat dissipation problems. When the package contains both high-power FC and WB chips, how to export FC chips effectively needs to be focused on. This paper introduces a kind of irregular heat cover based on AlN material, it can be seen from the simulation this heat dissipation cover can effectively export the heat of FC chip without affecting the structure of other chips. AlN has good material properties and mature processing, which can be widely used in high-power multiple chips SiP in the future.
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