Irradiation-induced grain growth in gold and copper: In situ HVEM studies at 75-300 K

Abstract

When thin polycrystalline films of Au, Cu and various other materials are subjected to energetic ion irradiation, the average grain size increases even at cryogenic temperatures. As is the case with many ion beam processes, this phenomenon of ion irradiation induced grain growth exhibits only a very mild temperature dependence. This contribution is based on in situ experiments, performed at the HVEM-Tandem User Facility at Argonne National Laboratory. This Facility interfaces a 2 MV Tandem ion accelerator and a 0.6 MV ion implanter to a 1.2 MV AEI high voltage electron microscope, which allows a wide variety of in situ ion beam experiments to be performed with simultaneous irradiation and electron microscopy or diffraction. A series of in situ ion and/or electron irradiation experiments is being performed at the HVEM-Tandem Facility at Argonne which have shown clearly for fine grained Au films that two mechanisms for growth are operative for the ion beam case: grain boundary migration as in normal thermal grain growth and grain coalescence which is similar in appearance to recrystallization by subgrain coalescence. Especially in the case of Au for which ion-induced growth is relatively rapid, such in situ experiments also demonstrate the importance of dislocation activity which is a consequence of the collision cascade damage associated with ion irradiation. Existing theories for irradiation-induced grain growth assume that growth occurs by boundary migration and that only point defects generated at grain boundaries are responsible for the growth phenomenon.