Abstract
We describe a form of deposition in which material is vaporized in a crucible and the vapor then ejected through a fine nozzle at the focus of an electron beam in a high vacuum. The vapor, on emerging from the nozzle, is partially condensed into clusters that are ionized by electron bombardment and then accelerated onto the substrate. The deposited films show good adhesion and large crystallite size. Examples include the deposition of Cu onto glass, Si onto Si, and ZnS onto NaCl.
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