Abstract

Silicon nitride layers of 140nm thickness were deposited on silicon wafers by low pressure chemical vapour deposition (LPCVD). The samples were irradiated in the electronic slowing-down regime, with either Pb ions of 110MeV (Se=19.3keVnm−1) or Xe ions of 710MeV (Se=22.1keVnm−1). Using infrared absorption spectroscopy, the radiation-induced disorder in Si3N4 was analysed as a function of the ion fluence (up to 4×1013cm−2). Some targets irradiated at low fluences (∼109cm−2) were etched at room temperature in aqueous HF solution (10vol.%) for various durations. The processed surfaces were probed using atomic force microscopy (AFM) in order to evidence etched tracks and to measure their mean surface diameter. The non-simultaneous emergences of the nanopores at the Si3N4/Si interface and the limited etching efficiency allow to conclude that the tracks are probably discontinuous in the present irradiation conditions.

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