Abstract
InGaN-based blue light-emitting diodes (LEDs), with their high efficiency and brightness, are entering the display industry. However, a significant gap remains between the expectation of highly efficient light sources and their experimental realization into tiny pixels for ultrahigh-density displays for augmented reality (AR). Her, we report using tailored ion implantation (TIIP) to fabricate highly-efficient, electrically-driven pixelated InGaN microLEDs (μLEDs) at the mid-submicron scale (line/space of 0.5/0.5 μm. Moreover, we demonstrate high-density TFT and QD C/F integration technologies.
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