Abstract
This chapter describes the creation of an Intermediate Band (IB) on single crystal silicon substrates by means of high-dose Ti implantation and subsequent Pulsed Laser Melting (PLM). The Ti concentration over the Mott limit is confirmed by Time-of-Flight Secondary Ion Mass Spectroscopy (ToF-SIMS) measurements and the recovery of the crystallinity after annealing by means of Glancing Incidence X Ray Diffraction (GIXRD) and Transmission Electron Microscopy (TEM). Rutherford Backscattering Spectroscopy (RBS) measurements show that most of the atoms are located interstitially. Analysis of the sheet resistance and mobility measured using the van der Pauw geometry shows a temperature-dependent decoupling between the implanted layer and the substrate. This decoupling and the high laminated conductivity of the implanted layer could not be explained except if we assume that an IB has been formed in the semiconductor. A specific model for the bilayer electrical behaviour has been developed. The fitting of this model and also the simulation of the sheet resistance with the ATLAS code allow to determine that the IB energetic position is located around 0.36–0.38 eV below the conduction band. Carriers at the IB have a density very similar to the Ti concentration and behave as holes with mobilities as low as 0.4 cm2 Vs− 1.
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