Abstract
A comparison study is performed to evaluate the feasibility of ion cutting of metallic glass (MG) by using hydrogen ion and helium ion implantation. MG Ti40Cu31Pd14Zr10Sn2Si3 is implanted with 100 keV He ions to a dose of 5 × 1017 ions/cm2 at room temperature. Transmission electron microscopy (TEM) shows formation of high density helium-filled bubbles at the projected range of He implants, while the near surface region of MG still retains its glassy state. The helium-implanted MG is bonded with a plastic substrate and an external force is used to de-bond the structure. The cleavage occurs at the helium projected range, which makes it possible to transfer the top MG layer onto the bonded rigid substrate. In comparison, H ion irradiation cannot form such weak and porous structure. The findings can be used to fabricate various MG-based devices and sensors.
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