Abstract
Thin Fe and Ta layers of 30–45 nm thickness, deposited via magnetron sputtering on Si (100) substrates, were bombarded at room temperature with 100 keV Ar1+ or Ar8+ or with 250 keV Xe1+ or Xe19+ ions in order to test the influence of the ion charge state on the surface sputtering and interface mixing. The samples were characterized by means of Rutherford backscattering at 0.9–3.0 MeV α-particle energy, time-of-flight elastic recoil detection analysis with a 53 MeV 127I10+ beam and atomic force microscopy. No influence of the charge state on the sputtering and athermal mixing rate was observed in the case of the Ta/Si system. However, in the case of the Fe/Si system, the ion charge was observed to have an influence on the mixing rate.
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