Abstract
Thermosonic flip-chip bonding is a new solderless technology for area-array connections. Its simple, clean and dry process may significantly reduce the assembly cost for chip-on-glass connections for displays, quick prototyping of MCMs, bonding for optoelectronic modules, and low-cost flip-chip packages. The feasibility of the technology has been demonstrated by our study of 64-I/O GaAs-on-silicon test vehicles. However, further studies are needed to develop a high-yield assembly process. To assist the development, we have reviewed different theories for the critical acoustic softening effect, and developed models for ultrasonic wave propagation and thermocompression bonding. The results of the review and the model developments are reported.
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