Abstract
The interplay between ionic adsorption, underpotential deposition and excess bond enthalpy in the deposition of materials will be discussed based on selections from recent work. Examples of limiting behavior will be presented that range from the deposition of solid-solutions, e.g. Pt-Cu and Pt-Fe group alloys, to intermetallics, e.g. Pt-Pb, to immiscible, e.g. Cu-Pb, systems. In addition, contributions of “parasitic” electrolyte breakdown reactions on the deposition of elements and alloys will also be briefly discussed. Close coupling between electroanalytical, gravimetric, metallurgical and surface science measurements enable the underlying thermodynamic and kinetic influences on co-deposition process to be revealed.
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