(Invited) Ultrapure Water for Advance Semiconductor Manufacturing: Challenges and Opportunities

Abstract

Increasing complexity driven by “Moore and More” continuously challenges Ultrapure water (UPW) process capabilities. The “killer” particle size has shrunk to 10nm for the most advanced semiconductor processes, which is beyond the capability of most UPW treatment technologies. Recent data suggests that particles in UPW may exceed current industry requirements. New industry standards have been developed recently to better understand and mitigate the defectivity challenge, which is escalating as the killer particle size approaches limitations of the best available filtration technology. In addition to particles, other trace contaminants pose risks to the most advanced manufacturing. This includes hydrogen peroxide generated in Ultraviolet treatment as well as dissolved organic contaminants, either originating from incoming city water or introduced by UPW system materials. Better understanding of the effects of UPW impurities to the manufacturing process can help to mitigate risks to yield loss and thereby reduce costs.